| Aspect Ratio: |
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Ratio of the PCB thickness to the diameter of the smallest hole |
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COB:
(Chip on board) |
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Semiconductor chip packages mounted directly to the board surface and connected by bond wires |
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| Double Sided PCB: |
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Printed Circuit Boards with circuits on both sides |
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EMC:
(Electro-Magnetic Compliance) |
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Noise regulations controlling electronic pulses |
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IC:
(Integrated Circuit) |
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An electronic circuit containing transistors, diodes, resistors, capacitors, etc. packaged and contained within a single chip of silicon |
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| Mixed Signal Electronics: |
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A complete circuit consisting of digital and analog components |
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| Multi-layer PCB: |
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Printed Circuit Boards with circuits on both sides, plus layers of circuits inside the PCB base material |
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| Pad: |
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The portion of conductive pattern on printed circuits designated for mounting or attaching components |
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| Single Sided PCB: |
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Printed Circuit Boards with circuits on one side |
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SMT:
(Surface Mount Technology) |
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Component legs are soldered directly to pad areas on the surface of the board |
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| Through Hole Technology: |
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Component leads, or legs, are inserted into holes in the board and attached to pad areas on the opposite side of the board |
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| Trace Layouts: |
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Current paths which make up the circuit on the PCB; usually drawn with CAD and transferred to magnetic tape, photographic images or computer disk; also called artwork |
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| Trace Widths: |
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The actual width of the circuit paths on the printed circuit boards |
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Triac:
(bi-directional triode thyristor) |
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A solid state power device used to control output current to AC electrical loads, such as motors and heating elements |
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| Via: |
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A plated through hole that is used as an inter-layer connection with no component leads or other material inside |
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| Wave Soldering: |
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A process in which pre-assembled printed circuit boards are brought in contact with a continuously flowing and circulating mass of solder |
